硅片表面形貌測量VIT系列
NEW: Virtual Interface Technology for 3D-IC Metrology:
-TSV profile (depth, bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height
-Edge trim profile
3DIC TSV and BWS TTV硅片表面形貌測量
Film Stress薄膜應力量測儀
FEOL Electrical Characterization 電學特性
Thin wafer metrology 晶圓測量學
Film Adhesion漆膜附著力測試NEW: Virtual Interface Technology for 3D-IC Metrology:
-TSV profile (depth, bottom CD, tilt, SWA)
-Residue Detection
-RST
-Copper Nail Height
-Bump Height and Cu pillar height
-Edge trim profile
